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HDI Flex PCB Manufacturer with μVias &Copper Filling Process in BGA Area
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HDI Flex PCB Manufacturer with μVias &Copper Filling Process in BGA Area
Type: Rigid-Flex PCB
Material: Polyimide
Layer Count: 2L
Surface Finish: ENIG
HDI Flex Rigid PCB with 2 Layer Flex Circuit and 6 Layer FR4 Circuit
Shengyi FR4 S7136 High Frequency PCB for Communication Antenna
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