Item

Description

Layer Count

1-30 layers

1-2 layers (Aluminum, CEM-3)

PCB Materials

FR-4, FR-406, 370HR, RO4350

Aluminum and Copper base

Finished Board Thickness

0.008’’-0.275’’

0.2mm-7mm

Min Board Thickness

2 layer: 0.008" (0.2mm)

4 layer: 0.016" (0.4mm)

6 layer: 0.024" (0.6mm)

8 layer: 0.032" (0.8mm)

10 layer: 0.04”(1mm)

>10layer: (0.5x layer count x 0.008”)

Min Core Thickness

3mil

Min Dielectric

4mil

Min Starting Copper Foil Weight

1/4oz

Min Laser Drill Diameter

Standard 4mil; Advanced 3mil

Laser Hole Location Tolerance

5mil

Conductive Filled Vias

Yes

None Conductive Filed Vias

Yes

Special Process

Impedance Control (Request±5%, 50ohm)

High Tg

halogen-free

High Tg & halogen-free

Heavy Copper up to 12oz

Via-in-pad

Buried vias

Blind vias

Staggered vias

Different copper weight on every layer

Selective gold plating

High thermal conductivity IMS/MCPCB board for LED light

1200mm – 1500mm long PCB board

(1W/m*K, 1.5 W/m*K, 2 W/m*K, 3 W/m*K, 4 W/m*K)

Max / Min PCB Size

1- 2Layer: Max -59" x 50"/ Min-0.2" x 0.2"

4- 6Layer: Max-32" x 28" / Min-0.4" x 0.4"

8-12Layer: Max-30" x 24" / Min-0.4" x 0.4"

>14 layer: need to confirm stack-up

Min Line Width / Clearance

Inner Layers           Outer Layers
0.5oz: 3/3mil          1/3oz：3/3mil
1oz: 4/4mil             Hoz: 4/4mil
2oz: 4/6mil             1oz: 5/6mil
3oz: 5/10mil           2oz: 6/10mil
4oz: 6/13mil           3oz: 6/14mil
5oz: 7/16mil           4oz: 8/17mil
6oz: 8/18mil           5oz: 9/20mil
                            6oz: 10/23mil

Aspect Ratio

Board Thickness       Min Hole Size
8-62mil                     6mil

80mil                        8mil

93mil                        9mil

125mil                      12mil

Min Hole Ring

Inner:                   Outer:

1/2oz: 5mil            1/3oz-1/2oz: 4mil

1oz: 6mil               1oz: 5mil

2oz: 8mil               2oz: 7mil

3oz: 12mil             3oz: 10mil

4oz: 15mil             4oz: 16mil

5oz: 18mil             5oz: 18mil

6oz: 20mil             6oz: 20mil

Copper Thickness

Inner: 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz

Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz

Heavy copper weight up to 12oz

Standard Stack Up

4 layer

6layer

8layer

10layer

Min Hole Size & Tolerance

6mil ±3mil

Surface Finishes

HASL lead free (Copper: 20-35μm Tin: 5-20μm)

Immersion Gold /ENIG (Ni: 100-200μ’’, Au:2-4μ’’)

Plating Gold (Ni: 100-200μ’’, Au: 4-8μ’’)

Selective Gold: (Ni: 100-200μ’’, Au: 4-8μ’’)

Gold Finger (Ni: 100-200μ’’, Au: 5-30μ’’)

Immersion Silver (Ag: 6-12μ’)

OSP (Film: 8-20μ’)

ENEPIG (Ni: 100-200μ'', Pd: 4-8μ'', Au: 1-4μ'')

Solder Mask Color

Glossy: Green, Black, Red, Yellow, White, Purple, Blue

Matt: Green, Black and others

Solder Mask Resolution

Solder Mask Thickness: 0.2-1.6mil

Solder Dam: Green 7mil (Other Color 8mil)

Solder Mask Hole Plug Dia.: 10-25mil

Silk Screen Color

White, Black and others

Routed Array

Yes

V Score, Edge to Copper

15mil

V Score Angles / Bevel

15°, 20°, 30°, 45°, 60°

Couterbore / Countersink

Yes

Edge Plating

Yes

Profile

Punching Tool: ±5mil

CNC Tool: ±5mil

V-Cut Tool: ±10mil

Beveling Edge: ±5mil

Slot Hole min: 32mil

BOW & Twist

SMT≤0.75%

None SMT≤1%

Accept Standard

IPC Class II

IPC Class III