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full turnkey class 2 PCB assembly for dual core A20 application

PCB Material: FR-4, PTFE, Al...
Max size: 510*460mm
Min size: 50*30mm
Min Chip size: 0201
Pitch: 0.25mm
BGA ball Dia.: 0.1-0.63mm
Part Package: IC, SOP, SOT, QFN, QFP, BGA
Inspection: visual, AOI, X-ray

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